SN74AVC1T45YZPR vs 74AVC1T45GW,125 feature comparison

SN74AVC1T45YZPR Rochester Electronics LLC

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74AVC1T45GW,125 NXP Semiconductors

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Pbfree Code No
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code BGA TSSOP
Package Description GREEN, DSBGA-6 PLASTIC, SOT-263, SC-88, 6 PIN
Pin Count 6 6
Reach Compliance Code unknown compliant
Additional Feature TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B
Family AVC AVC
JESD-30 Code R-PBGA-B6 R-PDSO-G6
JESD-609 Code e1 e3
Length 1.4 mm 2 mm
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Moisture Sensitivity Level 1 1
Number of Bits 1 2
Number of Functions 1 2
Number of Ports 2 2
Number of Terminals 6 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 5.6 ns 15.5 ns
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 0.8 V
Supply Voltage-Nom (Vsup) 1.5 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN SILVER COPPER Tin (Sn)
Terminal Form BALL GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 0.9 mm 1.25 mm
Base Number Matches 2 2
Manufacturer Package Code SOT363
HTS Code 8542.39.00.01
Control Type COMMON CONTROL
Count Direction BIDIRECTIONAL
Max I(ol) 0.006 A
Package Equivalence Code TSSOP6,.08
Packing Method TR
Prop. Delay@Nom-Sup 9.9 ns
Qualification Status Not Qualified

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