SN74AUP1G17YZPR vs 74AUP1G17GM feature comparison

SN74AUP1G17YZPR Texas Instruments

Buy Now Datasheet

74AUP1G17GM Philips Semiconductors

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC PHILIPS SEMICONDUCTORS
Part Package Code BGA
Package Description GREEN, PLASTIC , WCSP-5 SON, SOLCC6,.04,20
Pin Count 5
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family AUP/ULP/V
JESD-30 Code R-XBGA-B5 R-PDSO-N6
JESD-609 Code e1 e0
Length 1.4 mm
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.004 A 0.0017 A
Moisture Sensitivity Level 1
Number of Functions 1
Number of Inputs 1
Number of Terminals 5 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code VFBGA SON
Package Equivalence Code BGA5,2X3,20 SOLCC6,.04,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.0009 mA
Prop. Delay@Nom-Sup 19.8 ns 18.1 ns
Propagation Delay (tpd) 19.8 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 0.8 V
Supply Voltage-Nom (Vsup) 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
Terminal Form BALL NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 0.9 mm
Base Number Matches 1 3

Compare SN74AUP1G17YZPR with alternatives