SN74AUP1G08DCKTG4 vs 74AUP1G09GF/S500 feature comparison

SN74AUP1G08DCKTG4 Texas Instruments

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74AUP1G09GF/S500 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description TSSOP, TSSOP5/6,.08 VSON,
Pin Count 5
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G5 S-PDSO-N6
JESD-609 Code e4
Length 2 mm 1 mm
Load Capacitance (CL) 30 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSON
Package Equivalence Code TSSOP5/6,.08
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 25.5 ns
Propagation Delay (tpd) 25.5 ns 24 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.2 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.35 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm 1 mm
Base Number Matches 1 1

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Compare 74AUP1G09GF/S500 with alternatives