SN74AS762N3 vs 74LVTH244BPW,118 feature comparison

SN74AS762N3 Texas Instruments

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74LVTH244BPW,118 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Package Description DIP, DIP20,.3 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ONE FUNCTION WITH INVERTED OUTPUTS
Control Type ENABLE LOW ENABLE LOW
Family AS LVT
JESD-30 Code R-PDIP-T20 R-PDSO-G20
Length 24.325 mm 6.5 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 4 4
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Characteristics OPEN-COLLECTOR 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP20,.3 TSSOP20,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Power Supply Current-Max (ICC) 87 mA
Propagation Delay (tpd) 6 ns 3.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO YES
Technology TTL BICMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.62 mm 4.4 mm
Base Number Matches 1 2
Part Package Code TSSOP2
Pin Count 20
Manufacturer Package Code SOT360-1
Factory Lead Time 4 Weeks
JESD-609 Code e4
Max I(ol) 0.064 A
Moisture Sensitivity Level 1
Packing Method TR
Prop. Delay@Nom-Sup 3.5 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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Compare 74LVTH244BPW,118 with alternatives