SN74AS181ADW
vs
MC10H302P
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
MOTOROLA INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
DIP, DIP16,.3
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD
|
|
| Family |
AS
|
10H
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDIP-T16
|
| JESD-609 Code |
e4
|
|
| Length |
15.4 mm
|
19.175 mm
|
| Logic IC Type |
ARITHMETIC LOGIC UNIT
|
PARITY GENERATOR/CHECKER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
4
|
6
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
24
|
16
|
| Operating Temperature-Max |
70 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
3-STATE
|
OPEN-EMITTER
|
| Output Polarity |
INVERTED
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
21 ns
|
2.5 ns
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
4.44 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
TTL
|
ECL
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.5 mm
|
7.62 mm
|
| Base Number Matches |
2
|
3
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
DIP16,.3
|
|
|
|
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