SN74ALVTH16244KR
vs
CD74LCX16245SM96
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
BGA
|
|
| Package Description |
PLASTIC, VFBGA-56
|
,
|
| Pin Count |
56
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
ALSO OPERATES AT 3.3V SUPPLY
|
WITH DIRECTION CONTROL
|
| Control Type |
ENABLE LOW
|
|
| Family |
ALVT
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PBGA-B56
|
R-PDSO-G48
|
| Length |
7 mm
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS TRANSCEIVER
|
| Max I(ol) |
0.024 A
|
|
| Number of Bits |
4
|
8
|
| Number of Functions |
4
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
56
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
|
| Package Equivalence Code |
BGA56,6X10,25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Prop. Delay@Nom-Sup |
2.5 ns
|
|
| Propagation Delay (tpd) |
3.5 ns
|
5.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4.5 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare SN74ALVTH16244KR with alternatives
Compare CD74LCX16245SM96 with alternatives