SN74ALVCH16820DGGR
vs
74ALVC16834ADGG,11
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
GREEN, PLASTIC, TSSOP-56
|
TSOP2,
|
| Pin Count |
56
|
56
|
| Reach Compliance Code |
unknown
|
unknown
|
| Family |
ALVC/VCX/A
|
ALVC/VCX/A
|
| JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G56
|
| JESD-609 Code |
e4
|
e4
|
| Length |
14 mm
|
14 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
10
|
18
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
56
|
56
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSOP2
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
5.9 ns
|
5 ns
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.2 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
2.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
6.1 mm
|
6.1 mm
|
| Base Number Matches |
2
|
2
|
| Manufacturer Package Code |
|
SOT364-1
|
| Additional Feature |
|
IT CAN ALSO OPERATE FROM 2.3V TO 2.7V OR 3.0V TO 3.6V SUPPLY
|
|
|
|
Compare SN74ALVCH16820DGGR with alternatives
Compare 74ALVC16834ADGG,11 with alternatives