SN74ALS233DW
vs
N74F225D
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
SOP, SOP20,.4
|
SOP, SOP20,.4
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Clock Frequency-Max (fCLK) |
25 MHz
|
50 MHz
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| Length |
12.8 mm
|
|
| Memory Density |
80 bit
|
|
| Memory IC Type |
OTHER FIFO
|
OTHER FIFO
|
| Memory Width |
5
|
5
|
| Number of Functions |
1
|
|
| Number of Terminals |
20
|
20
|
| Number of Words |
16 words
|
16 words
|
| Number of Words Code |
16
|
16
|
| Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
16X5
|
16X5
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP20,.4
|
SOP20,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.5 mm
|
|
| Base Number Matches |
1
|
3
|
| Access Time-Max |
|
25 ns
|
| JESD-609 Code |
|
e0
|
| Supply Current-Max |
|
0.095 mA
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare SN74ALS233DW with alternatives