SN74AHC1G00HDCK3 vs 74HC1G00GW,125 feature comparison

SN74AHC1G00HDCK3 Texas Instruments

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74HC1G00GW,125 NXP Semiconductors

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Pbfree Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Package Description TSSOP, TSSOP5/6,.08 PLASTIC, SC-88A, 5 PIN
Reach Compliance Code unknown compliant
Family AHC/VHC/H/U/V HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-G5
Length 2 mm 2 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 14 ns 135 ns
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.25 mm
Base Number Matches 1 2
Rohs Code Yes
Part Package Code TSSOP
Pin Count 5
Manufacturer Package Code SOT353-1
HTS Code 8542.39.00.01
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30

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Compare 74HC1G00GW,125 with alternatives