SN74AHC139PWG4
vs
MC74VHC139DTR2
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MOTOROLA INC
|
Part Package Code |
TSSOP
|
|
Package Description |
TSSOP, TSSOP16,.25
|
PLASTIC, TSSOP-16
|
Pin Count |
16
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
AHC/VHC/H/U/V
|
AHC/VHC
|
Input Conditioning |
STANDARD
|
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e4
|
|
Length |
5 mm
|
5 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
2-LINE TO 4-LINE DECODER
|
OTHER DECODER/DRIVER
|
Max I(ol) |
0.008 A
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
2
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
INVERTED
|
INVERTED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP16,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TUBE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
10.5 ns
|
|
Propagation Delay (tpd) |
16.5 ns
|
16.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
4.4 mm
|
4.4 mm
|
Base Number Matches |
1
|
4
|
|
|
|
Compare SN74AHC139PWG4 with alternatives