SN65DSI84ZQER
vs
SN65DSI84TPAPRQ1
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
BGA-64
|
HTQFP-64
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
|
| Data Rate |
1000 Mbps
|
1000 Mbps
|
| JESD-30 Code |
S-PBGA-B64
|
S-PQFP-G64
|
| JESD-609 Code |
e1
|
e4
|
| Length |
5 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
85 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
HTFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
5 mm
|
10 mm
|
| Base Number Matches |
1
|
1
|
| Date Of Intro |
|
2016-12-13
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Screening Level |
|
AEC-Q100
|
|
|
|