SN54LS155J
vs
SN74LS155JDS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-XDIP-T16
R-XDIP-T16
JESD-609 Code
e0
e0
Logic IC Type
OTHER DECODER/DRIVER
OTHER DECODER/DRIVER
Max I(ol)
0.004 A
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
5 V
5 V
Power Supply Current-Max (ICC)
10 mA
Prop. Delay@Nom-Sup
30 ns
Qualification Status
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
6
3