SN54LS12J
vs
M38510/30006BCA
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP,
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
LS
JESD-30 Code
R-CDIP-T14
R-XDIP-T14
JESD-609 Code
e0
e0
Length
19.56 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
3
Number of Inputs
3
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
OPEN-COLLECTOR
OPEN-COLLECTOR
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
28 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
5
7
Max I(ol)
0.004 A
Package Equivalence Code
DIP14,.3
Power Supplies
5 V
Power Supply Current-Max (ICC)
3.3 mA
Prop. Delay@Nom-Sup
60 ns
Schmitt Trigger
NO
Screening Level
38535Q/M;38534H;883B
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