SN54LS114AFK
vs
HD74LS114FP-EL
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
QFN
|
SOIC
|
| Package Description |
QCCN, LCC20,.35SQ
|
SOP,
|
| Pin Count |
20
|
14
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH INDIVIDUAL SET INPUTS
|
WITH INDIVIDUAL SET INPUTS
|
| Family |
LS
|
LS
|
| JESD-30 Code |
S-CQCC-N20
|
R-PDSO-G14
|
| Length |
8.89 mm
|
10.06 mm
|
| Load Capacitance (CL) |
15 pF
|
|
| Logic IC Type |
J-K FLIP-FLOP
|
J-K FLIP-FLOP
|
| Number of Bits |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
14
|
| Operating Temperature-Max |
125 °C
|
75 °C
|
| Operating Temperature-Min |
-55 °C
|
-20 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
SOP
|
| Package Equivalence Code |
LCC20,.35SQ
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Power Supply Current-Max (ICC) |
6 mA
|
|
| Propagation Delay (tpd) |
20 ns
|
30 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.03 mm
|
2.2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
COMMERCIAL EXTENDED
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Trigger Type |
NEGATIVE EDGE
|
NEGATIVE EDGE
|
| Width |
8.89 mm
|
5.5 mm
|
| fmax-Min |
45 MHz
|
30 MHz
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare SN54LS114AFK with alternatives
Compare HD74LS114FP-EL with alternatives