SN54HC365J vs TC74HC365AP feature comparison

SN54HC365J Texas Instruments

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TC74HC365AP Toshiba America Electronic Components

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Pbfree Code Yes
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TOSHIBA CORP
Part Package Code DIP DIP
Package Description 0.300 INCH, CERAMIC, DIP-16 DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Additional Feature WITH DUAL OUTPUT ENABLE
Control Type ENABLE LOW ENABLE LOW
Count Direction UNIDIRECTIONAL
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T16 R-PDIP-T16
JESD-609 Code e0
Length 19.56 mm 19.25 mm
Load Capacitance (CL) 150 pF 150 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A 0.006 A
Number of Bits 6 6
Number of Functions 6 1
Number of Ports 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Power Supply Current-Max (ICC) 0.08 mA
Prop. Delay@Nom-Sup 29 ns 23 ns
Propagation Delay (tpd) 180 ns 165 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.45 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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