SN54H11J
vs
S54H11F
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
NXP SEMICONDUCTORS
Package Description
DIP,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
TTL/H/L
TTL/H/L
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
JESD-609 Code
e0
e0
Length
19.56 mm
Logic IC Type
AND GATE
AND GATE
Number of Functions
3
3
Number of Inputs
3
3
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
12 ns
12 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
1
Load Capacitance (CL)
25 pF
Max I(ol)
0.02 A
Package Equivalence Code
DIP14,.3
Power Supply Current-Max (ICC)
48 mA
Prop. Delay@Nom-Sup
12 ns
Schmitt Trigger
NO
Compare SN54H11J with alternatives
Compare S54H11F with alternatives