SN54AS762FKR
vs
74ALVTH32244ZKER
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QLCC
|
BGA
|
| Package Description |
QCCN,
|
LFBGA-96
|
| Pin Count |
20
|
96
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ONE FUNCTION WITH INVERTED OUTPUTS
|
ALSO OPERATES WITH 3.3V SUPPLY
|
| Family |
AS
|
ALVT
|
| JESD-30 Code |
S-CQCC-N20
|
R-PBGA-B96
|
| Length |
8.89 mm
|
13.5 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Number of Bits |
4
|
4
|
| Number of Functions |
2
|
8
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
96
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
LFBGA
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Power Supply Current-Max (ICC) |
87 mA
|
5 mA
|
| Propagation Delay (tpd) |
20 ns
|
3.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.03 mm
|
1.4 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
BICMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
8.89 mm
|
5.5 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| Control Type |
|
ENABLE LOW
|
| Count Direction |
|
UNIDIRECTIONAL
|
| JESD-609 Code |
|
e1
|
| Max I(ol) |
|
0.024 A
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
BGA96,6X16,32
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
2.5 ns
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare SN54AS762FKR with alternatives
Compare 74ALVTH32244ZKER with alternatives