SN54AS1000J-00
vs
MC74F37N
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DIP,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
AS
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
Length
19.56 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
Number of Inputs
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
19 mA
33 mA
Propagation Delay (tpd)
4.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
4
Rohs Code
JESD-609 Code
e0
Max I(ol)
0.064 A
Package Equivalence Code
DIP14,.3
Power Supplies
5 V
Prop. Delay@Nom-Sup
6.5 ns
Schmitt Trigger
NO
Terminal Finish
Tin/Lead (Sn/Pb)
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