SN54ALS157J-00 vs 74HCT157PW,112 feature comparison

SN54ALS157J-00 Texas Instruments

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74HCT157PW,112 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Package Description DIP, 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family ALS HCT
JESD-30 Code R-GDIP-T16 R-PDSO-G16
Length 19.56 mm 5 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 4.4 mm
Base Number Matches 1 2
Rohs Code Yes
Part Package Code TSSOP
Pin Count 16
Manufacturer Package Code SOT403-1
Factory Lead Time 4 Weeks
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP16,.25
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 41 ns
Propagation Delay (tpd) 56 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

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Compare 74HCT157PW,112 with alternatives