SN5409J
vs
SN74LS08FN
feature comparison
Part Life Cycle Code |
Active
|
Contact Manufacturer
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
Package Description |
DIP,
|
LCC-20
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
TTL/H/L
|
LS
|
JESD-30 Code |
R-GDIP-T14
|
S-PQCC-J20
|
Length |
19.56 mm
|
8.9662 mm
|
Logic IC Type |
AND GATE
|
AND GATE
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Terminals |
14
|
20
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Output Characteristics |
OPEN-COLLECTOR
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
QCCJ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Propagation Delay (tpd) |
24 ns
|
20 ns
|
Seated Height-Max |
5.08 mm
|
4.57 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
TTL
|
TTL
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
J BEND
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
7.62 mm
|
8.9662 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare SN5409J with alternatives
Compare SN74LS08FN with alternatives