SMX55161A-75GBM vs SMJ55166-75GBM feature comparison

SMX55161A-75GBM Micross Components

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SMJ55166-75GBM Texas Instruments

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROSS COMPONENTS TEXAS INSTRUMENTS INC
Part Package Code PGA PGA
Package Description CERAMIC, PGA-68 PGA, PGA68,9X9
Pin Count 68 68
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode FAST PAGE FAST PAGE WITH EDO
Access Time-Max 75 ns 75 ns
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT
JESD-30 Code S-CPGA-P68 S-CPGA-P68
Length 24.38 mm 24.38 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type VIDEO DRAM VIDEO DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 2
Number of Terminals 68 68
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 256KX16 256KX16
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA PGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.62 mm 2.23 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS MOS
Temperature Grade MILITARY MILITARY
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Width 24.38 mm 24.38 mm
Base Number Matches 1 1
Rohs Code No
Package Equivalence Code PGA68,9X9
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.012 A
Supply Current-Max 0.225 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare SMX55161A-75GBM with alternatives

Compare SMJ55166-75GBM with alternatives