SMX55161A-70GBI
vs
SMJ55166-75GB
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROSS COMPONENTS
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
PGA
|
PGA
|
Package Description |
CERAMIC, PGA-68
|
PGA,
|
Pin Count |
68
|
68
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.02
|
8542.32.00.02
|
Access Mode |
FAST PAGE
|
FAST PAGE WITH EDO
|
Access Time-Max |
70 ns
|
75 ns
|
Additional Feature |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
|
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT
|
JESD-30 Code |
S-CPGA-P68
|
S-CPGA-P68
|
Length |
24.38 mm
|
24.38 mm
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
VIDEO DRAM
|
VIDEO DRAM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
2
|
Number of Terminals |
68
|
68
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Organization |
256KX16
|
256KX16
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
PGA
|
PGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.62 mm
|
3.62 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
Width |
24.38 mm
|
24.38 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare SMX55161A-70GBI with alternatives
Compare SMJ55166-75GB with alternatives