SMP1307-004LF
vs
MA3X555
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
SKYWORKS SOLUTIONS INC
|
PANASONIC CORP
|
Package Description |
GREEN, PLASTIC PACKAGE-3
|
R-PDSO-G3
|
Pin Count |
3
|
3
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Date Of Intro |
1997-06-01
|
|
Samacsys Manufacturer |
Skyworks
|
|
Additional Feature |
LOW DISTORTION
|
|
Application |
ATTENUATOR
|
|
Breakdown Voltage-Min |
200 V
|
40 V
|
Configuration |
COMMON CATHODE, 2 ELEMENTS
|
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
Diode Capacitance-Max |
0.3 pF
|
0.5 pF
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Forward Resistance-Max |
3 Ω
|
10 Ω
|
Diode Res Test Current |
100 mA
|
|
Diode Res Test Frequency |
100 MHz
|
|
Diode Type |
PIN DIODE
|
PIN DIODE
|
Frequency Band |
HIGH FREQUENCY TO L BAND
|
ULTRA HIGH FREQUENCY TO KA BAND
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
JESD-609 Code |
e3
|
|
Minority Carrier Lifetime-Nom |
1.5 µs
|
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
2
|
2
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
150 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Dissipation-Max |
0.25 W
|
0.15 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare SMP1307-004LF with alternatives
Compare MA3X555 with alternatives