SMP-81EY
vs
NE5060F
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
HERMETIC SEALED, CERDIP-14
|
DIP,
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Acquisition Time-Nom |
3.5 µs
|
0.85 µs
|
| Amplifier Type |
SAMPLE AND HOLD CIRCUIT
|
SAMPLE AND HOLD CIRCUIT
|
| Analog Input Voltage-Max |
11.5 V
|
11 V
|
| Analog Input Voltage-Min |
-11.5 V
|
-11 V
|
| Droop Rate-Max |
2 V/s
|
200 V/s
|
| JESD-30 Code |
R-GDIP-T14
|
R-GDIP-T14
|
| JESD-609 Code |
e0
|
|
| Length |
19.43 mm
|
19.535 mm
|
| Neg Supply Voltage Limit-Max |
-18 V
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-25 °C
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Supply Voltage Limit-Max |
18 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
4
|
| Acquisition Time-Max |
|
1.25 µs
|
|
|
|
Compare SMP-81EY with alternatives
Compare NE5060F with alternatives