SMN16AS-335-JB
vs
SMN16AS-335-JT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
RCD COMPONENTS INC
RCD COMPONENTS INC
Package Description
DIP
DIP
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.10
8533.21.00.10
Construction
Epoxy Molded
Epoxy Molded
Element Power Dissipation
0.25 W
0.25 W
First Element Resistance
3300000 Ω
3300000 Ω
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Network Type
ISOLATED
ISOLATED
Number of Elements
1
1
Number of Functions
8
8
Number of Terminals
16
16
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
2 mm
2 mm
Package Length
7.7 mm
7.7 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SOIC
SOIC
Package Width
11 mm
11 mm
Packing Method
BULK
TAPE, EMBOSSED PLASTIC
Rated Power Dissipation (P)
0.75 W
0.75 W
Rated Temperature
25 °C
25 °C
Resistance
3300000 Ω
3300000 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Second/Last Element Resistance
3300000 Ω
3300000 Ω
Size Code
3043
3043
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Temperature Coefficient Tracking
50 ppm/°C
50 ppm/°C
Terminal Shape
GULL WING
GULL WING
Tolerance
5%
5%
Working Voltage
25 V
25 V
Base Number Matches
1
1
Compare SMN16AS-335-JB with alternatives
Compare SMN16AS-335-JT with alternatives