SMLJ8.5-TP
vs
SMLJ8.5E3
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS
|
MICROSEMI CORP
|
| Part Package Code |
DO-214AB
|
DO-214AB
|
| Package Description |
SMC, 2 PIN
|
R-PDSO-C2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Additional Feature |
EXCELLENT CLAMPING CAPABILITY, PD-MIN
|
|
| Breakdown Voltage-Max |
11.52 V
|
11.5 V
|
| Breakdown Voltage-Min |
9.43 V
|
9.44 V
|
| Breakdown Voltage-Nom |
10.47 V
|
10.47 V
|
| Clamping Voltage-Max |
15.9 V
|
21.5 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JEDEC-95 Code |
DO-214AB
|
DO-214AB
|
| JESD-30 Code |
R-PDSO-C2
|
R-PDSO-C2
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Peak Rev Power Dis-Max |
3000 W
|
3000 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-55 °C
|
-65 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
UL RECOGNIZED
|
|
| Rep Pk Reverse Voltage-Max |
8.5 V
|
8.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
| Terminal Form |
C BEND
|
C BEND
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Base Number Matches |
1
|
1
|
| Power Dissipation-Max |
|
1.61 W
|
| Reverse Current-Max |
|
25 µA
|
|
|
|
Compare SMLJ8.5-TP with alternatives
Compare SMLJ8.5E3 with alternatives