SML4759AHE3_A/I
vs
MSP1N3039BUR-1
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
MICROSEMI CORP
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Factory Lead Time |
8 Weeks
|
|
| Date Of Intro |
2019-02-07
|
|
| Samacsys Manufacturer |
Vishay
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-214AC
|
DO-213AB
|
| JESD-30 Code |
R-PDSO-C2
|
O-LELF-R2
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
175 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
1 W
|
1.25 W
|
| Reference Standard |
AEC-Q101
|
|
| Reference Voltage-Nom |
62 V
|
62 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
C BEND
|
WRAP AROUND
|
| Terminal Position |
DUAL
|
END
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
4 mA
|
4 mA
|
| Base Number Matches |
1
|
4
|
| Part Package Code |
|
DO-213AB
|
| Package Description |
|
O-LELF-R2
|
| Pin Count |
|
2
|
| Additional Feature |
|
METALLURGICALLY BONDED, HIGH RELIABILITY
|
| Case Connection |
|
ISOLATED
|
| Operating Temperature-Min |
|
-65 °C
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare SML4759AHE3_A/I with alternatives
Compare MSP1N3039BUR-1 with alternatives