SMJ61CD16-45JDM
vs
P4C167L-45CMB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
PYRAMID SEMICONDUCTOR CORP
Package Description
DIP-20
0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
45 ns
Additional Feature
AUTOMATIC POWER-DOWN
JESD-30 Code
R-CDIP-T20
R-CDIP-T20
Memory Density
16384 bit
16384 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
20
20
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
16KX1
16KX1
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
20
JESD-609 Code
e0
Screening Level
MIL-STD-883 Class B
Seated Height-Max
5.08 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare SMJ61CD16-45JDM with alternatives
Compare P4C167L-45CMB with alternatives