SMJ4464-12JDL
vs
MSM41464-12JS
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
LAPIS SEMICONDUCTOR CO LTD
Part Package Code
DIP
Package Description
0.300 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-18
QCCJ, LDCC18,.33X.53
Pin Count
18
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
PAGE
Access Time-Max
120 ns
120 ns
Additional Feature
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O Type
COMMON
COMMON
JESD-30 Code
R-CDIP-T18
R-PQCC-J18
Length
22.606 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
PAGE MODE DRAM
PAGE MODE DRAM
Memory Width
4
4
Number of Functions
1
Number of Ports
1
Number of Terminals
18
18
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64KX4
64KX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Equivalence Code
DIP18,.3
LDCC18,.33X.53
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
256
256
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
NMOS
MOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
J BEND
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Base Number Matches
2
2
JESD-609 Code
e0
Supply Current-Max
0.065 mA
Terminal Finish
Tin/Lead (Sn/Pb)
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