SMJ320C40TABM40/10
vs
SM320C40GFM40
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
DIE
PGA
Package Description
DIE, TAB,325PINS,.01
SPGA, SPGA325,35X35MOD
Pin Count
325
325
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
31
31
Barrel Shifter
YES
YES
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
40 MHz
40 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-XUUC-N325
S-CPGA-P325
Low Power Mode
YES
YES
Number of Terminals
325
325
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIE
SPGA
Package Equivalence Code
TAB,325PINS,.01
SPGA325,35X35MOD
Package Shape
SQUARE
SQUARE
Package Style
UNCASED CHIP
GRID ARRAY, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (words)
8192
2000
Screening Level
MIL-PRF-38535
Supply Current-Max
850 mA
850 mA
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
PIN/PEG
Terminal Pitch
0.254 mm
1.27 mm
Terminal Position
UPPER
PERPENDICULAR
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Pbfree Code
Rohs Code
Samacsys Manufacturer
Texas Instruments
Integrated Cache
NO
Length
47.245 mm
Number of DMA Channels
6
Number of External Interrupts
5
Number of Serial I/Os
Number of Timers
2
On Chip Data RAM Width
32
On Chip Program ROM Width
Peak Reflow Temperature (Cel)
NOT SPECIFIED
ROM (words)
4G
Seated Height-Max
5.08 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
47.245 mm
Compare SMJ320C40TABM40/10 with alternatives
Compare SM320C40GFM40 with alternatives