SMJ320C40KGDM40CH vs SM320C40GFM33 feature comparison

SMJ320C40KGDM40CH Texas Instruments

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SM320C40GFM33 Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code DIE
Package Description DIE, PGA, SPGA325,35X35MOD
Pin Count 325
Reach Compliance Code unknown not_compliant
ECCN Code 3A001.A.2.C 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 31 31
Barrel Shifter NO YES
Boundary Scan YES YES
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code R-XUUC-N325 S-CPGA-P325
Low Power Mode NO NO
Number of Terminals 325 325
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIE PGA
Package Shape RECTANGULAR SQUARE
Package Style UNCASED CHIP GRID ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD PIN/PEG
Terminal Position UPPER PERPENDICULAR
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 1
Rohs Code No
Bit Size 32
Clock Frequency-Max 33.33 MHz
Integrated Cache NO
Number of DMA Channels 6
Number of External Interrupts 5
Number of Serial I/Os
Number of Timers 2
On Chip Data RAM Width 32
Package Equivalence Code SPGA325,35X35MOD
Peak Reflow Temperature (Cel) NOT SPECIFIED
RAM (words) 1024
Supply Current-Max 850 mA
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare SMJ320C40KGDM40CH with alternatives

Compare SM320C40GFM33 with alternatives