SMJ320C40GFS60
vs
SMJ320C40KGDM40D
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
PGA
DIE
Package Description
SPGA, SPGA325,35X35MOD
DIE, DIE OR CHIP
Pin Count
325
325
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
31
31
Barrel Shifter
YES
NO
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
60 MHz
40 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-CPGA-P325
S-XUUC-N325
JESD-609 Code
e0
Length
47.245 mm
Low Power Mode
YES
NO
Number of DMA Channels
6
Number of Terminals
325
325
Number of Timers
2
Operating Temperature-Max
100 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
SPGA
DIE
Package Equivalence Code
SPGA325,35X35MOD
DIE OR CHIP
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, SHRINK PITCH
UNCASED CHIP
Qualification Status
Not Qualified
Not Qualified
RAM (words)
8192
8192
ROM (words)
4G
Screening Level
MIL-PRF-38535
MIL-PRF-38535
Seated Height-Max
5.08 mm
Supply Current-Max
850 mA
850 mA
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
PIN/PEG
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
PERPENDICULAR
UPPER
Width
47.245 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare SMJ320C40GFS60 with alternatives
Compare SMJ320C40KGDM40D with alternatives