SME1040BGA-266
vs
SME1040BGA-300
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SUN MICROSYSTEMS INC
|
SUN MICROSYSTEMS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA587,28X28,50
|
BGA, BGA587,28X28,50
|
| Pin Count |
587
|
587
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO REQUIRES 3.3V
|
ALSO REQUIRES 3.3V
|
| Address Bus Width |
32
|
32
|
| Bit Size |
64
|
64
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
266 MHz
|
300 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B587
|
S-PBGA-B587
|
| JESD-609 Code |
e0
|
e0
|
| Length |
37.5 mm
|
37.5 mm
|
| Low Power Mode |
NO
|
NO
|
| Number of Terminals |
587
|
587
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA587,28X28,50
|
BGA587,28X28,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.45 mm
|
3.45 mm
|
| Speed |
266 MHz
|
300 MHz
|
| Supply Voltage-Max |
2.68 V
|
2.68 V
|
| Supply Voltage-Min |
2.52 V
|
2.52 V
|
| Supply Voltage-Nom |
2.6 V
|
2.6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
37.5 mm
|
37.5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|