SMBJ5937BE3/TR13
vs
MXSMBJ5937B
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
End Of Life
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
20 Weeks
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
33 Ω
|
|
| Number of Elements |
1
|
1
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
2 W
|
1.25 W
|
| Reference Voltage-Nom |
33 V
|
33 V
|
| Surface Mount |
YES
|
YES
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
11.4 mA
|
11.4 mA
|
| Base Number Matches |
1
|
4
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
DO-214AA
|
| Package Description |
|
R-PDSO-C2
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Diode Element Material |
|
SILICON
|
| JEDEC-95 Code |
|
DO-214AA
|
| JESD-30 Code |
|
R-PDSO-C2
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Min |
|
-65 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Reference Standard |
|
MIL-19500
|
| Technology |
|
ZENER
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
C BEND
|
| Terminal Position |
|
DUAL
|
|
|
|
Compare SMBJ5937BE3/TR13 with alternatives
Compare MXSMBJ5937B with alternatives