SMBJ5381BHE3-TP
vs
MXSMBG5381BTR
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
MICROSEMI CORP
|
| Package Description |
SMB , 2 PIN
|
R-PDSO-G2
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Samacsys Manufacturer |
MCC
|
|
| Additional Feature |
HIGH SURGE CURRENT CAPABILITY
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
190 Ω
|
|
| Forward Voltage-Max (VF) |
1.2 V
|
|
| JEDEC-95 Code |
DO-214AA
|
DO-215AA
|
| JESD-30 Code |
R-PDSO-C2
|
R-PDSO-G2
|
| JESD-609 Code |
e3
|
e0
|
| Knee Impedance-Max |
1250 Ω
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-65 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
5 W
|
1.38 W
|
| Reference Standard |
AEC-Q101
|
MIL-19500
|
| Reference Voltage-Nom |
130 V
|
130 V
|
| Reverse Current-Max |
0.0005 µA
|
|
| Reverse Test Voltage |
98.8 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
C BEND
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Working Test Current |
10 mA
|
10 mA
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
DO-215AA
|
| Pin Count |
|
2
|
| Voltage Tol-Max |
|
5%
|
|
|
|
Compare SMBJ5381BHE3-TP with alternatives
Compare MXSMBG5381BTR with alternatives