SMBJ26C
vs
SMBJ26C
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Active
|
| Ihs Manufacturer |
JGD SEMICONDUCTORS CO LTD
|
TAIWAN SEMICONDUCTOR CO LTD
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Breakdown Voltage-Nom |
32.1 V
|
32.1 V
|
| Clamping Voltage-Max |
46.6 V
|
46.6 V
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| Polarity |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Rep Pk Reverse Voltage-Max |
26 V
|
26 V
|
| Surface Mount |
YES
|
YES
|
| Base Number Matches |
2
|
28
|
| Rohs Code |
|
Yes
|
| Package Description |
|
SMB, 2 PIN
|
| Additional Feature |
|
EXCELLENT CLAMPING CAPABILITY
|
| Breakdown Voltage-Max |
|
35.3 V
|
| Breakdown Voltage-Min |
|
28.9 V
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| JEDEC-95 Code |
|
DO-214AA
|
| JESD-30 Code |
|
R-PDSO-C2
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Peak Rev Power Dis-Max |
|
600 W
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Dissipation-Max |
|
3 W
|
| Qualification Status |
|
Not Qualified
|
| Reverse Current-Max |
|
1 µA
|
| Reverse Test Voltage |
|
26 V
|
| Technology |
|
AVALANCHE
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
C BEND
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare SMBJ26C with alternatives
Compare SMBJ26C with alternatives