SMAJP4KE170CE3
vs
SA17CA-AP
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICRO COMMERCIAL COMPONENTS CORP
|
| Part Package Code |
DO-214AC
|
DO-15
|
| Package Description |
R-PDSO-C2
|
O-PALF-W2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Breakdown Voltage-Max |
187 V
|
20.9 V
|
| Breakdown Voltage-Min |
153 V
|
18.9 V
|
| Breakdown Voltage-Nom |
170 V
|
19.9 V
|
| Clamping Voltage-Max |
244 V
|
27.6 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JEDEC-95 Code |
DO-214AC
|
DO-15
|
| JESD-30 Code |
R-PDSO-C2
|
O-PALF-W2
|
| Non-rep Peak Rev Power Dis-Max |
400 W
|
500 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Polarity |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Power Dissipation-Max |
1.52 W
|
3 W
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
138 V
|
17 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Form |
C BEND
|
WIRE
|
| Terminal Position |
DUAL
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
10
|
| Base Number Matches |
10
|
2
|
| Pbfree Code |
|
Yes
|
| Additional Feature |
|
EXCELLENT CLAMPING CAPABILITY
|
| Case Connection |
|
ISOLATED
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Reference Standard |
|
UL RECOGNIZED
|
| Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare SMAJP4KE170CE3 with alternatives
Compare SA17CA-AP with alternatives