SM8J45
vs
BT137-600F
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TO-220AB
|
TO-220AB
|
| Package Description |
FLANGE MOUNT, R-PSFM-T3
|
PLASTIC PACKAGE-3
|
| Pin Count |
3
|
3
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.30.00.80
|
8541.30.00.80
|
| Case Connection |
MAIN TERMINAL 2
|
MAIN TERMINAL 2
|
| Configuration |
SINGLE
|
SINGLE
|
| Critical Rate of Rise of Commutation Voltage-Min |
10 V/us
|
|
| DC Gate Trigger Current-Max |
30 mA
|
25 mA
|
| DC Gate Trigger Voltage-Max |
2 V
|
1.5 V
|
| Holding Current-Max |
50 mA
|
20 mA
|
| JEDEC-95 Code |
TO-220AB
|
TO-220AB
|
| JESD-30 Code |
R-PSFM-T3
|
R-PSFM-T3
|
| Leakage Current-Max |
2 mA
|
0.5 mA
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RMS On-state Current-Max |
8 A
|
8 A
|
| Repetitive Peak Off-state Leakage Current-Max |
2000 µA
|
500 µA
|
| Repetitive Peak Off-state Voltage |
600 V
|
600 V
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Trigger Device Type |
TRIAC
|
4 QUADRANT LOGIC LEVEL TRIAC
|
| Base Number Matches |
2
|
1
|
| Critical Rate of Rise of Off-State Voltage-Min |
|
50 V/us
|
|
|
|
Compare SM8J45 with alternatives
Compare BT137-600F with alternatives