SM564013174N6BF
vs
M965G0115MQ0-C70
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SMART MODULAR TECHNOLOGIES
SAMSUNG SEMICONDUCTOR INC
Part Package Code
DIMM
MODULE
Package Description
DIMM-144
DIMM, DIMM144,32
Pin Count
144
144
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
JESD-30 Code
R-XDMA-N144
R-XDMA-N144
Memory Density
67108864 bit
67108864 bit
Memory IC Type
SYNCHRONOUS DRAM MODULE
SYNCHRONOUS GRAPHICS RAM MODULE
Memory Width
64
64
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
1MX64
1MX64
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Terminal Form
NO LEAD
NO LEAD
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Access Mode
DUAL BANK PAGE BURST
Access Time-Max
5.5 ns
Additional Feature
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
143 MHz
I/O Type
COMMON
Operating Temperature-Max
70 °C
Operating Temperature-Min
Output Characteristics
3-STATE
Package Equivalence Code
DIMM144,32
Refresh Cycles
2048
Self Refresh
YES
Standby Current-Max
0.004 A
Supply Current-Max
0.46 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Temperature Grade
COMMERCIAL
Terminal Pitch
0.8 mm
Compare SM564013174N6BF with alternatives
Compare M965G0115MQ0-C70 with alternatives