SM0-67204EV-50SB
vs
5962-8956808Q9A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
TEMIC SEMICONDUCTORS
E2V TECHNOLOGIES PLC
Package Description
DIE
DIE,
Reach Compliance Code
unknown
unknown
Access Time-Max
50 ns
15 ns
Cycle Time
65 ns
25 ns
JESD-30 Code
X-XUUC-N
X-XUUC-N
Memory Density
36864 bit
36864 bit
Memory Width
9
9
Number of Functions
1
1
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
4KX9
4KX9
Output Enable
NO
NO
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
UNSPECIFIED
UNSPECIFIED
Package Style
UNCASED CHIP
UNCASED CHIP
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Base Number Matches
2
2
Part Package Code
DIE
ECCN Code
EAR99
HTS Code
8542.32.00.71
JESD-609 Code
e0
Package Code
DIE
Screening Level
MIL-PRF-38535 Class Q
Terminal Finish
TIN LEAD
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