SLE24C08-D vs 24C08BE/P feature comparison

SLE24C08-D Infineon Technologies AG

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24C08BE/P Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG MICROCHIP TECHNOLOGY INC
Part Package Code DIP DIP
Package Description PLASTIC, DIP-8 0.300 INCH, PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 0.1 MHz 0.1 MHz
Data Retention Time-Min 40 200
Endurance 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C Control Byte 1010MMMR 1010XMMR
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e0
Length 9.4 mm 9.46 mm
Memory Density 8192 bit 8192 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1KX8 1KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.7 mm 4.32 mm
Serial Bus Type I2C I2C
Standby Current-Max 0.00005 A 0.0001 A
Supply Current-Max 0.003 mA 0.003 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 8 ms 10 ms
Write Protection HARDWARE HARDWARE
Base Number Matches 2 1
Output Characteristics 3-STATE

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