SLE24C01-D
vs
CAT24C01BPI-1.8REV-A
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
SIEMENS A G
|
CATALYST SEMICONDUCTOR INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
,
|
PLASTIC, DIP-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.51
|
|
Clock Frequency-Max (fCLK) |
0.1 MHz
|
0.1 MHz
|
JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
Memory Density |
1024 bit
|
1024 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
128 words
|
128 words
|
Number of Words Code |
128
|
128
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
128X8
|
128X8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Serial Bus Type |
I2C
|
I2C
|
Supply Voltage-Max (Vsup) |
5.5 V
|
6 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
1.8 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Write Cycle Time-Max (tWC) |
8 ms
|
10 ms
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Package Code |
|
DIP
|
Peak Reflow Temperature (Cel) |
|
240
|
Terminal Finish |
|
TIN LEAD
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare SLE24C01-D with alternatives
Compare CAT24C01BPI-1.8REV-A with alternatives