SL6679/KG/TP1N
vs
PCD5008H
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ZARLINK SEMICONDUCTOR INC
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
QFP, TQFP32,.35SQ,32
|
QFP, QFP32,.35SQ,32
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G32
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
55 °C
|
70 °C
|
| Operating Temperature-Min |
-10 °C
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Equivalence Code |
TQFP32,.35SQ,32
|
QFP32,.35SQ,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
|
| Telecom IC Type |
TELECOM CIRCUIT
|
PAGING DECODER
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
3
|
2
|
| Supply Current-Max |
|
50 mA
|
|
|
|