SKN2F17/04
vs
SKN2F17/04UNF
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SEMIKRON INTERNATIONAL
|
SEMIKRON INTERNATIONAL
|
| Part Package Code |
DO-4
|
DO-4
|
| Package Description |
O-MUPM-D1
|
O-MUPM-D1
|
| Pin Count |
1
|
1
|
| Manufacturer Package Code |
CASE E7
|
CASE E7
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
LEAKAGE CURRENT IS TYPICAL
|
LEAKAGE CURRENT IS TYPICAL
|
| Application |
FAST SOFT RECOVERY
|
FAST SOFT RECOVERY
|
| Case Connection |
ANODE
|
ANODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
2.15 V
|
2.15 V
|
| JEDEC-95 Code |
DO-203AA
|
DO-203AA
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| JESD-609 Code |
e2
|
e3/e4
|
| Non-rep Pk Forward Current-Max |
380 A
|
380 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
10 A
|
10 A
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
400 V
|
400 V
|
| Reverse Current-Max |
200 µA
|
200 µA
|
| Reverse Recovery Time-Max |
0.44 µs
|
0.44 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN SILVER
|
TIN/SILVER
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
2
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|