SI5319A-C-GM
vs
SI5319A-C-GMR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
SKYWORKS SOLUTIONS INC
|
| Part Package Code |
QFN
|
|
| Package Description |
6 X 6 MM, ROHS COMPLIANT, MO-220VJJD, QFN-36
|
6 X 6 MM, ROHS COMPLIANT, MO-220VJJD, QFN-36
|
| Pin Count |
36
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Silicon Labs
|
|
| Additional Feature |
IT CAN ALSO OPERATES 2.5V OR 3.3V NON SUPPLY
|
IT CAN ALSO OPERATES 2.5V OR 3.3V NON SUPPLY
|
| JESD-30 Code |
S-XQCC-N36
|
S-XQCC-N36
|
| Length |
6 mm
|
6 mm
|
| Number of Terminals |
36
|
36
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Clock Frequency-Max |
1417 MHz
|
1417 MHz
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC36,.25SQ,20
|
LCC36,.25SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Primary Clock/Crystal Frequency-Nom |
710 MHz
|
710 MHz
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Supply Current-Max |
243 mA
|
243 mA
|
| Supply Voltage-Max |
1.89 V
|
1.89 V
|
| Supply Voltage-Min |
1.71 V
|
1.71 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
6 mm
|
6 mm
|
| uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, OTHER
|
CLOCK GENERATOR, OTHER
|
| Base Number Matches |
2
|
1
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|