SI53102-A2-GMR
vs
SI53102-A2-GM
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
SKYWORKS SOLUTIONS INC
|
SILICON LABORATORIES INC
|
| Package Description |
TDFN-8
|
TDFN-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
Skyworks
|
Silicon Labs
|
| Additional Feature |
ALSO OPERATES AT 3.3 V SUPPLY
|
ALSO OPERATES AT 3.3 V SUPPLY
|
| Family |
53102
|
53102
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDSO-N8
|
| Length |
1.6 mm
|
1.6 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
8
|
8
|
| Number of True Outputs |
4
|
4
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC8,.06,16
|
SOLCC8,.06,16
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
15 mA
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.1 ns
|
0.1 ns
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Max (Vsup) |
2.75 V
|
2.75 V
|
| Supply Voltage-Min (Vsup) |
2.25 V
|
2.25 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
1.4 mm
|
1.4 mm
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
DFN
|
| Pin Count |
|
8
|
| HTS Code |
|
8542.39.00.01
|
|
|
|