SI52111-B6-GM2
vs
SI52112-B5-GM2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
SKYWORKS SOLUTIONS INC
SILICON LABORATORIES INC
Package Description
TDFN-10
3 X 3 MM, ROHS COMPLIANT, MO-229, TDFN-10
Reach Compliance Code
compliant
compliant
JESD-30 Code
S-PDSO-N10
S-PDSO-N10
Length
3 mm
3 mm
Number of Terminals
10
10
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Clock Frequency-Max
100 MHz
100 MHz
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
HVSON
Package Shape
SQUARE
SQUARE
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Primary Clock/Crystal Frequency-Nom
25 MHz
25 MHz
Seated Height-Max
0.8 mm
0.8 mm
Supply Voltage-Max
3.46 V
3.46 V
Supply Voltage-Min
3.13 V
3.13 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
3 mm
3 mm
uPs/uCs/Peripheral ICs Type
CLOCK GENERATOR, PROCESSOR SPECIFIC
CLOCK GENERATOR, PROCESSOR SPECIFIC
Base Number Matches
2
2
ECCN Code
EAR99
HTS Code
8542.39.00.01
Compare SI52111-B6-GM2 with alternatives
Compare SI52112-B5-GM2 with alternatives