SI4702-C19-GM
vs
TDA5633MDK-T
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
|
| Package Description |
3 X 3 MM, ROHS COMPLIANT, QFN-20
|
LSSOP,
|
| Pin Count |
20
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Silicon Labs
|
|
| Built-in IF Amplifier |
YES
|
YES
|
| Consumer IC Type |
AUDIO TUNER
|
VIDEO TUNER
|
| Input Frequency-Max (RF) |
108 MHz
|
887.5 MHz
|
| Input Frequency-Min (RF) |
76 MHz
|
57.5 MHz
|
| JESD-30 Code |
S-XQCC-N20
|
R-PDSO-G20
|
| JESD-609 Code |
e3
|
|
| Length |
3 mm
|
6.5 mm
|
| Moisture Sensitivity Level |
3
|
|
| Noise Figure-Nom |
58 dB
|
10 dB
|
| Number of Bands |
2
|
2
|
| Number of Functions |
1
|
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
LSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.6 mm
|
1.5 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
9.9 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
8.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3 mm
|
4.4 mm
|
| Base Number Matches |
2
|
1
|
| Supply Current-Max |
|
48 mA
|
|
|
|
Compare SI4702-C19-GM with alternatives
Compare TDA5633MDK-T with alternatives