SI4500DY
vs
NDS8858H
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
FAIRCHILD SEMICONDUCTOR CORP
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Drain Current-Max (ID) |
7 A
|
6.3 A
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-609 Code |
e0
|
e3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Polarity/Channel Type |
N-CHANNEL AND P-CHANNEL
|
N-CHANNEL AND P-CHANNEL
|
Power Dissipation-Max (Abs) |
2.5 W
|
2.5 W
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
Base Number Matches |
2
|
5
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
SOIC
|
Package Description |
|
SOIC-8
|
Pin Count |
|
8
|
Manufacturer Package Code |
|
8LD, SOIC,JEDEC MS-012, .150" NARROW BODY, DUAL DAP
|
HTS Code |
|
8541.29.00.95
|
Configuration |
|
COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
|
30 V
|
Drain-source On Resistance-Max |
|
0.035 Ω
|
JESD-30 Code |
|
R-PDSO-G8
|
Moisture Sensitivity Level |
|
1
|
Number of Elements |
|
2
|
Number of Terminals |
|
8
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Terminal Form |
|
GULL WING
|
Terminal Position |
|
DUAL
|
Transistor Application |
|
SWITCHING
|
Transistor Element Material |
|
SILICON
|
|
|
|
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