SI4460-BXX-FM
vs
3D3523-5
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
SILICON LABORATORIES INC
|
DATA DELAY DEVICES INC
|
Package Description |
HVQCCN,
|
DIP,
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Telecom IC Type |
TELECOM CIRCUIT
|
MANCHESTER ENCODER/DECODER
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
DIP
|
Pin Count |
|
14
|
JESD-30 Code |
|
R-PDIP-T14
|
Length |
|
19.305 mm
|
Number of Functions |
|
1
|
Number of Terminals |
|
14
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
DIP
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
4.57 mm
|
Supply Voltage-Nom |
|
3.3 V
|
Surface Mount |
|
NO
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
7.62 mm
|
|
|
|
Compare SI4460-BXX-FM with alternatives
Compare 3D3523-5 with alternatives